CSD17307Q5A

The CSD17307Q5A N-Channel NexFET™ Power MOSFET by Texas Instruments represents a pinnacle of innovation in field-effect transistor technology. Designed with precision for high-efficiency applications, this compact yet powerful component is a testament to Texas Instruments’ commitment to delivering state-of-the-art solutions for modern electronic needs.

With its ultra-low on-resistance of just 5.8 mΩ at VGS = 10V, the CSD17307Q5A is meticulously engineered to minimize losses and improve power efficiency across a wide range of applications. This makes it an ideal choice for power management tasks in both consumer electronics and industrial systems, where efficiency is paramount. The device operates with a maximum drain-source voltage (VDS) of 30V, providing a balanced performance for high-speed switching applications.

Housed in a compact 5mm x 6mm SON package, the CSD17307Q5A is designed for space-constrained applications, offering a high power density that is crucial for modern, miniaturized electronics. Its package design also enhances thermal performance, ensuring reliability and longevity even under high-stress conditions.

The transistor’s gate charge (Qg) is optimized for fast switching, reducing switching losses and improving overall performance. With a threshold voltage designed for logic-level drive, the CSD17307Q5A is easily interfaced with a wide range of controllers and driving circuits, making it a versatile component for designing efficient power conversion and management systems.

Applications for the CSD17307Q5A are vast and varied, including synchronous buck converters, server and telecom power supplies, OR-ing and hot-swap applications, and motor control circuits. Its robust performance characteristics also make it suitable for high-efficiency power supply designs and energy-sensitive applications where power loss must be minimized.

In summary, the CSD17307Q5A from Texas Instruments is a high-performance, N-channel power MOSFET that combines low on-resistance with high-speed switching capabilities in a compact, thermally efficient package. Designed for a wide range of high-efficiency applications, it stands as a testament to Texas Instruments’ leadership in semiconductor innovation, providing designers with a reliable, high-performance component for their most demanding applications.